Evonik For Composites

REACTIVE RESIN MODIFIERSThe nanoparticles are chemicallymanufacturing processes. As theNANOPOX syn thesized from aqueous sodiumsilica nanoparticles do not sedi-Evonik is the leading manufacturersilicate solution. In this unique pro-ment, even solvent-based prepregg -of surface modified silica nanopar-cess the epoxy matrix resin is noting does not pose a problem.ticles in epoxy resins. Using nano altered, in contrast to processes insilica several important propertieswhich powdered fillers are dis-Due to their small size and the ab-of fiber reinforced composites canpersed with dissolvers or othersence of any larger aggregates, thebe improved:equipment using high shear energy.nanoparticles can easily penetrate allfiber structures without compromis- Significantly improved modulusThese products are concentratesing the impregnation by excessiveand, for most composite applica-viscosity, thereby enabling all thetions, are diluted with standard ep-state-of-the-art process technologiesoxy resins. Typical nanosilica levelslike resin infusion, RTM, or resin in- Increased toughnessin, e.g., VARTM resin systems arejection. In addition to significantly im- Improved surface quality10 percent.proved mechanical properties (mod-and flexural strength Drastically improved fatigueperformance(reduced print through)ulus, fracture toughness), the thermal Reduced microcrack formationThe NANOPOX products areexpansion, shrinkage and electricalsuitable for all hardeners and allproperties can also be improved.resinfiberfiberresin15 % nanosilica4 % nanosilica – TEM-Pictures of GFRCs with different levelsof SiO2-nano-particles (based on NANOPOX F 400)The standard grades of the NANOPOX product groupPRODUCTBASE RESINEEW[G/EQUIV]DYN. VISCOSITY,25 C [MPA·S]CHARACTERIZATIONNANOPOX F 400DGEBA29560,000Special for glass, aramideand carbon fibers;40% SiO2-nanoparticlesNANOPOX F 520DGEBF27520,000Low viscous; 40%SiO2-nanoparticlesNANOPOX F 631EEC2205,500Cycloaliphatic formulations;40% SiO2-nanoparticlesNANOPOX F 700epoxidized novolac31020,000 (at 50 C)High performance novolac,high TgEVONIK FOR COMPOSITES 11

MATRIX SYSTEMSALBIPOX These negative effects can belimitations in respect to the resinsEpoxy resins have a substantialavoided by toughening with co-and hardeners that can be used.disad vantage: their brittleness.polymers based on reactive elas-Typical addition levels are 25–40This disad vantage can be moretomers. However, the pure liquidpercent.than compensated by an elastomerelastomers are only slightly misci-modification (so-called "toughen-ble with epoxy resins, if at all.ing" or impact resistance modifi-As a synergy exists between themodification with NBR and nano-cation). In contrast to an elastifi The different ALBIPOX gradessilica, several products containcation, the elongation at break ofare reaction products betweenboth modifications.the cured modified resin normallyepoxy resins and an elastomericremains under 10 percent.copolymer. Hereby, an epoxyAn additional advantage is the resin is reacted with an excess improved processability of theThe toughening of epoxy resinsamount of the reactive liquidmodified laminates, therebyproves to be difficult, however. elastomer. After the reaction, theavoiding splintering on mechani-Thus, for example, the use ofelastomer molecules are epoxycal finishing. The shrinkage is alsoflexible hardeners or the additionfunctional and will be chemicallyreduced, as the rubber domainsof non-reactive flexibilizersbonded to the resin matrix duringformed upon cure can absorb the significantly impairs a number ofcuring.internal stresses arising duringimportant properties such as ten-curing.sile strength and modulus, thermalALBIPOX products can be usedand chemical resistance as well asby epoxy resin formulators likethermodimensional stability.a modular system. There are noThe standard grades of the ALBIPOX product group12 PRODUCTBASE RESINEEW[G/EQUIV]DYN. VISCOSITY,25 C [MPA·S]CHARACTERIZATIONALBIPOX 1000DGEBA330200,000Standard type, 40% NBRALBIPOX 3001DGEBA/DGEBF21522,000Application-ready resinALBIPOX 8001DGEBA210400,000; 4,000(at 80 C)Extremely efficient tackifier(addition level 3–5 %)ALBIPOX F 080DGEBA/DGEBF33070,000Contains NBR*) andnanoparticlesALBIPOX F 081DGEBA/DGEBF26035,000Contains NBR*) andnanoparticlesALBIPOX F 091DGEBA/DGEBF22015,000Contains NBR*) andnanoparticlesEVONIK FOR COMPOSITES

EVONIK FOR COMPOSITES 13

MATRIX SYSTEMSALBIDUR The silicone elastomer particlesshrink and no or minimal loss ofOne of the drawbacks of rubberhave an organic shell structuremodulus and Tg.toughening is the increase in vis-comprising reactive groups. Thecosity, which cannot be toleratedtoughening mechanism is the sameIn contrast to the ALBIPOX prod-in some in jection methods. Byas for reactive liquid rubbers;ucts, unsaturated polyester resins using core shell elastomers as however, the rubber domains areand vinyl ester resins can also betougheners, the viscosityalready preformed and not builtmodified with ALBIDUR based onincrease becomes minimal.during the curing process.such resins. Please refer to the separate ALBIDUR brochure.ALBIDUR products consist of aThe typical addition levels are 10reac tive resin in which siliconepercent and result in a substantiallyelastomer particles of a definedimproved toughness over a verysize (0.1–3 µm) are finely distributed.broad temperature range, reducedALBIDUR for epoxy resins14 PRODUCTBASE RESINEEW [G/EQUIV]DYN. VISCOSITY,25 C [MPA·S]ALBIDUR EP 2240 ADGEBA30035,000EVONIK FOR COMPOSITES

PROCESS ADDITIVES FOR EPOXY RESINS,the manufacturing process of fiber-reinforcedVINYL ESTER RESINS AND UNSATURATED composites can be made easier. If such an additivePOLYESTER RESINSis used as internal release agent, demolding evenTEGOPREN , TEGOMER , TEGO ANTIFOAMwithout using an external mold release agent is noproblem anymore. Surface properties like scratch re-PROPERTY AND PROCESSINGsistance can be increased significantly. The use ofIMPROVEMENTSdefoamers reduces the amount of bubbles or poresBy using small amounts of these additives in thermo-in a fiber-reinforced composite, which consequentlysetting resin formulations (typically 0.1 – 0.8 %)exhibits better mechanical performance.Technical data 11PRODUCT NAMECHEMICAL COMPOSITIONCHARACTERIZATIONTEGOMER DA 626Polymeric structuredispersing agent, defoamerTEGO Antifoam D 2340,TEGO Antifoam D 2345Polymer solutiondefoamerTEGOPREN 6875Alkyl-modified siloxanedispersing agent, improved scratchresistanceTEGOMER M-SI 2650Organo-modified siloxane contain ing non-reactive aromatic groupsinternal release agent, dispersingagentno specificationINTERNAL RELEASE AGENT fast demolding of the composite partEspecially in fast manufacturing processes like VARTM superior surface appearance of the composite partefficient demolding is necessary. Time and cost-inten- no negative effects on paintability of thesive external mold release agents cannot be used.Therefore internal release agents are part of the epoxyresin formulation. They offer several advantages:composite part no negative effects on processability of theepoxy resinEVONIK FOR COMPOSITES 15

MATRIX SYSTEMSInternal release agentRESINFIRST RECOMMENDATIONStandard epoxy resins0.1 – 0.2 % TEGOMER M-Si 2650Standard UP resins0.1 – 0.2 % TEGOMER M-Si 2650SECOND RECOMMENDATION0.1 – 0.2 % TEGOPREN 6875DEFOAMERSproblem in several composite manufacturing processesAir trapping and bubble formation can be a nastylike pultrusion or RTM processes.DefoamersRESIN/HARDENERFIRST RECOMMENDATIONSECOND RECOMMENDATIONEpoxy, anhydride cure0.2 – 0.8 % TEGOMER DA 6260.5 – 1 % TEGO Antifoam D 2340Epoxy, amine cure0.4 – 1 % TEGOMER DA 6260.5 – 1 % TEGO Antifoam D 2340UP resin, BPO or MEKP cured0.3 – 0.8 %TEGO Antifoam D 23450.1 – 0.2 % TEGOPREN 6875SCRATCH RESISTANCELow addition levels of 0.3 – 0.6 % can already yieldJust think about public transportation – and the scratchsignificant improvements. For the modification ofresistance of panels made from SMC becomes an immi- unsaturated polyester resins based on orthophthalicnent issue. The figure shows the possible improvements.acid we recommend these products:Scratch resistance116 CURING AGENTRECOMMENDATIONMethylethylketone peroxide (MEKP)TEGOMER M-Si 2650TEGOPREN 6875Dibenzoyl peroxide (BPO)TEGOPREN 6875no specificationEVONIK FOR COMPOSITES

Scratch resistance of cured unsaturated polyester with 0.4 %TEGOMER M-Si 2650 / without additiveHOW IT WORKS Organo-modified silox-Schematic illustration of the structure of an OMS and itsinteraction with a polymeranes (OMS) consist of a siloxane backbonewith attached organic groups. The organicgroups ensure a permanent functionalization of the polymer without bleeding of theOMS. Different molecular architectures ofcomb-likeOMS derivatives are available. The figure atthe left shows the comb-like as well as thelinear structure of the OMS together withthe possible functional groups. By varyingthe density and nature of the attached or-linearganic groups the OMS called TEGOMER MethylgroupOrganic SubstituentsSilicon AlkylOxygen Epoxideor TEGOPREN are tailor-made productsto the final application. The figure belowshows the functionalization of a polymer Hydroxy Aminomatrix with OMS. These derivatives can Carboxyl either work for bulk modification (case A) Acrylateor for s urface modification (case B).OMSPolymerABEVONIK FOR COMPOSITES 17

MATRIX SYSTEMSEPOXY CURING AGENTSalso employed as anhydride and resistance, lower viscosity andEvonik is the leading supplier ofepoxy accelerators in heat curing.faster cure speed.agents to advance compositeAncamide curing agentsAmicure and Dicyanex prod-manu facturing and adhesivecan be divided into two majoructs are Dicyandiamide (DICY)bonding of composites.classes: amidoamines and poly-catalysts and substituted ureasamides. Amidoamines are knownfor one component heat cureThe portfolio contains a full rangefor low viscosity, excellent fiberhigh-performance compositesof high quality amine hardeners,wet-out and long pot life. Theyand adhesives.catalysts and accelerators for aare recommended for wet lay-upwide range of applications, includ-laminating and filament windingImicure products are imidazolesing infusion technologies, filamentapplications. Polyamides arewhich are tailor-made towinding and prepreg applications.known for low toxicity, very accelerate anhydride and aminehigh-performance epoxy curing18good adhesion to multiplecuring epoxy resins. They offerAncamine curing agents are substrates and good flexibility.a broad range of latency, rapidmostly cycloaliphatic amines usedEvonik offers a range of polyam-cure beyond activation tempera-across many different compositeides and adducts that includetures as well as high thermal andapplications, including filamentstandard grades as well as gradeschemical resistance in prepregwinding and pipe rehabilitationthat do not require an inductionapplications and bonding of com-applications. Modified amines aretime, improved chemicalposites. EVONIK FOR COMPOSITES

EVONIK FOR COMPOSITES 19

MATRIX SYSTEMSTop RecommendationsAdhesive Bonding of CompositesPipe Rehabilitation / CIPPWet/Hand Lay-upPultrusionPrepregCastingRTM / InfusionCOMPOSITES PROCESSING ROUTES/ APPLICATIONSFilament WindingToughness / Flexibility/ ThermoshockLap Shear & T-peerMechanical performance ILSS retentionChemical resistanceTemperature resistance High TgLow temp through-cureLow exothermCuring AgentLong pot life/ Latency @ 25 CTECHNOLOGYLow mix viscosityBENEFITSAncamine 2450*CycloaliphaticAncamine 2913*Ancamide 506AmidoamineAncamide 502Ancamide 2798Ancamide 351APolyamideAncamide 3030Ancamide 910Anhydride AccAncamine 2908A*Amicure 1200G**DicyandiamideDicyanex 1400B**Amicure UR2TImicure EMI24ImidazolesImicure AMI1Ancamine 2014 AS/FGAccelerators for heat cureAncamine K 54*not commercially available in EMEA** Benefits depending on formulationsexcellenthighly recommendedrecommended20 EVONIK FOR COMPOSITESEVONIK FOR COMPOSITES 21

MATRIX SYSTEMSVISIOMER METHACRYLATEEvonik offers a wide range ofdifferent mechanical properties,ENVIRONMENTALLYlow-volatile and low-odor methac-such as flexural strength and UVFRIENDLY SOLUTIONSrylate monomers for full or partialresistance. Evonik’s specialists canFOR FULL OR PARTIALsubstitution of styrene in compos-support you in optimizing your res-SUBSTITUTION OF STYRENEite resins. Our methacrylate-basedin systems to attain the requiredIN COMPOSITE RESINScrosslinkers, such as VISIOMER mechanical properties.1,4-BDDMA, are well known forThere has recently been growingcreating low-odor and styrene-freeThe recently developed VISIOMER concern in the composites industryresins with improved mechanicalGLYFOMA offers the possibility ofabout the use of styrene in unsatu-properties. They can be used alonecreating low-odor and styrene-freerated polyester resins (UPR) andor in combination with othervinyl ester based resins. VISIOM-vinyl ester (VE) formulations. Re-monofunctional methacrylateER GLYFOMA is partially bio-duction of styrene in applicationsmonomers such as VISIOMER based and has practically no odor;like open mold and hand lay-upTerra IBOMA and c-HMA. Theit is therefore highly recommendedprocessing, where workers are ex-combination of different VISIOMER for applications in which reactiveposed to styrene vapors, is an areaMethacrylates allows creation ofresins are handled in an open at-of interest for many companies.various styrene-free solutions withmosphere.The VISIOMER product group comprises the following methacrylates22 MONOMER GROUPVISIOMER APPLICATION AND GDMATRGDMAPEG200DMATMPTMAEnhance mechancial properties ofcomposite resinsAlkyl/arylmethacrylatesIBOA, Terra IBOMA, BNMA,c-HMAProvide good solubility for UP andVE resinsSpecial methacrylatesGLYFOMALow odor and potentially label freeEVONIK FOR COMPOSITES

EVONIK FOR COMPOSITES 23

MATRIX SYSTEMSBISMALEIMIDES COMPIMIDE (Tg). They offer improved hightemperature performance over ep- Co-monomersHigh performance materialsoxies and cyanate esters. Other Pre-formulated resin blends helping you to meet your future outstanding features are: Resin solutions requirements for advancedcomposites todayThe COMPIMIDE bismaleimideresin family represents a full rangeof proprietary thermosetting resinsand specialties that have been RTM resins Easy processing by autoclave,platen press, and compressionApplicationsmolding techniquesCOMPIMIDE thermosetting BMI Retention of excellent mechanical properties up to 250 C developed for the production of Good solvent resistancehigh-performance composites, Excellent performance in hot adhesives, and moldings.and wet conditionsresins and formulations have beendeveloped for the u se in all relevant processing techniques Prepregging Superior flame and radiation re- Resin Transfer Molding (RTM)Evonik offers more than 40 years ofsistance, low smoke and toxicant Vacuum Assisted Resin Infusionexperience in bismaleimide resins.emissionsOur products are certified and referenced throughout the industry.The COMPIMIDE BMI productresins are characterized by theirportfolio of bismaleimide productshigh glass transition temperaturein the market: EVONIK FOR COMPOSITES(VARI) Filament Winding (FW)COMPIMIDE bismaleimide matrix group offers the most complete24 Monomers Compression Molding And many more

MONOMERSCO-MONOMERSPREFORMUL ATED RESINSRESINSOLUTIONSRTM RESINS*COMPIMIDE MDAB4,4’-bismaleimidodiphenyl- methane;CAS 13676-54-5COMPIMIDE TM124o,o’-diallylbisphenol-A;CAS 1745-89-7COMPIMIDE 353 AEutectic mixtureof bismaleimidemonomersCOMPIMIDE 1206R55Formulatedresin solutionCOMPIMIDE 353RTM-STFormulatedresin blendCOMPIMIDE TDAB2,4-bismaleimidotoluene;CAS 6422-83-9COMPIMIDE TM124-Ether2,2’-bis[4-allyloxyphenyl] propane;CAS 3739-67-1COMPIMIDE 796Eutectic mixtureof bismaleimidemonomersCOMPIMIDE 1224 L60Formulatedresin solutionCOMPIMIDE 353RTM-HTFormulatedresin blendCOMPIMIDE MXBIm-xylylenebismaleimide;CAS 13676-53-4COMPIMIDE TM1234,4’-bis[o-propenylphenoxy]benzophenone;CAS 109423-33-8COMPIMIDE 50LMLow meltingeutectic mixtureof bismaleimidemonomersCOMPIMIDE 50L-RTMFormulatedresin blendCOMPIMIDE MAHD1,6-bismaleimidohexane;CAS 4856-87-5* One-pot melt blends for liquid resin processing including RTM, VARTM, resin infusion, etc.EPOXY AND PU RESINVESTALITE products are support-scale automated manufacturing.FORMULATIONS FORed by VESTARO to bring nextDue to Evonik’s blocking-agentAUTOMOTIVE LIGHTWEIGHTgeneration composites ontofree uretdione chemistry the pre-SOLUTIONSthe road with you. VESTAROpreg resins exhibit long shelf life atVESTALITE combines Evonik’s chemistry withambient conditions, manufacturingautomotive engineering.of form stable pre-forms and easyVESTALITE products arehandling with robots. tailor-made solutions for highVESTALITE Pperformance composite parts basedVESTALITE P resin formulationsVESTALITE P 312on epoxies and polyurethanes.yield non-toxic, reversibly shape POLYURETHANE RESINable prepregs for fast and automat- FORMULATION WITHVESTALITE products allow fored prepreg compression moldingEXCELLENT SURFACEcost-efficient and fast processingwith low investment costs.QUALITIESfor high performance compositeThe resin allows for excellent sur-parts which makes them particu-VESTALITE P is a matrix systemface qualities including high UVlarly suitable for next generationfor prepregs based on aliphaticstability and ductility. Due to lowautomotive composite applications. diisocyanates VESTANAT IPDI.reaction heat upon curing evenIts unique properties makethick parts can be cured within VESTALITE P suitable for large5 – 10 min at 140 – 150 C.EVONIK FOR COMPOSITES 25

MATRIX SYSTEMSApplicationson Evonik’s diamine chemistry. Exterior panelsIts unique properties make Exposed interior parts VESTALITE S suitable for large Leaf springsscale automated manufacturing.Due to Evonik’s diamine chemistryBenefitsthe resulting epoxy system exhibits Potential reduction ofa low initial viscosity, storage sta-painting costs Outstanding toughnessand flexibility Low exothermic curing reactionbility, fast curing and best in classmechanical performance. Due tothe EP chemistry VESTALITE Sbased SMC have lowest VOCs andno styrene emissions.VESTALITE P 342POLYURETHANE RESINApplicationsFORMULATION FOR METAL Semi-structural partsCOMPOSITE HYBRID PARTS Supporting structuresThe combination of conventional Exterior / Interior partssteel and aluminum grades withcomposite materials allows for aBenefitsmaterial- and cost-efficient light- Low initial viscosity for highweight approach. Since the resinexhibits excellent metal adhesionno additional primer or adhesive isneeded. fiber volumes and excellent fiberwetting High storage stabi

EPOXY COMPOSITES Common epoxy matrix resins are based on diglycidyl ether of bis-phenol A (DGEBA), which con-tains two epoxy groups, one at each end of the molecule. They are low-molecular-weight liquids. Typically, amines are used to cure the epoxy resins, after which a three-dimensional network is achieved. DIAMINES Evonik is one of the .