INVESTIGATION OF ACCELERATED STRESS - Jpl.nasa.gov

1y ago
5 Views
1 Downloads
4.46 MB
121 Pages
Last View : 2m ago
Last Download : 3m ago
Upload by : Allyson Cromer
Transcription

rwDPD Line Item No. SE-7DOE/JPL-954929-83/ 10INVESTIGATION OF ACCELERATED STRESSFACTORS AND FAIWREJDE GRADATIONMECHANISMS IN TERRESTRIALSOLAR CELLS(NASA-CR-173757) INVESTIGATION OFACCELERATED STRESS FACTORS ANDFAILURE/DEGRADATION BECRAYISfiS INTERRESTRIAL SOLAR CELLS Annual Report(Clemson Univ.) 121 p RC A06/tlF A01N84-28222Unclas;3/44 19840FOURTH ANNUAL KEPORT' OCTOBER 19 8 3J.W. LathropDepartment of Electrical and Computer EngineeringClemson University, Clemson, SC 29631FqFORJET , PROPULSION LABORATORYPREPARED'p cGC '9

y4iiDRD Line Item No. SE-7DOE/JPL - 954929-83/10tENGINEERING AREAs .YPHOTOVOLTAIC CELL RELIABILITY RESEARCH{IINVESTIGATION OF ACCELERATED STRESS FACTORSAND FAILURE/DEGRADATION MECHANISMS IN TERRESTRIAL SOLAR CELLSZs.eFOURTH ANNUAL REPORTRIJ.W. Lathrop1Department of Electrical and Computer EngineeringClemson University, Clemson, SC 29631October 19834The JPL Flat-Plate Solar Array Project is sponsored by the U.S. Departmentof Energy and is part of the Photovoltaic Energy Systems Program toinitiate a major effort toward the development of cost-competitive solararrays. This work was performed for the Jet Propulsion Laboratory,California Institute of Technology by agreement between NASA and DOE.

aq k.RCLEMSON PERSONNELPersons contributing to the work covered in this report include%sjDr. Jay W. Lathrop --Principal InvestigatorMr. Dexter C. Hawkins --Research AssociateMs. Clara White Davis --Graduate Student(Schottky barrier formation)Mr. Konstantinos Misiakos --Graduate Student(Schottky barrier formation)Mr. Foster B. White --Graduate Student(Sulfur dioxide tests)(Encapsulated call testing)Mr. H. Jarrett Cassell, Jr. — —Undergraduate StudentMr. Thomas A. Bolin — —Undergraduate StudentMr. Keith E. Summer --Undergraduate StudentMr. Paul Williamson --Undergraduate StudentMr. M. Lloyd Wright --Undergraduate Studentaii

. .:. . '1 4TR! 1. . . . . v.- . .,. . .:. n .: .,:f9}', .{PAPMJ A gR.rr { n " ACKNOWLEDGEMENTThe Jet Propulsion Laboratory Technical Manager for this work was Mr.Edward L. Royal. His assistance in acquiring test samples and in supplyingtechnical guidance to the program is gratefully acknowledged.The assistance of Dr. R. G. Delumyea of the Clemson UniversityChemistry Department, who made many helpful suggestions concerningdevelopment of the sulfur dioxide test, is gratefully acknowledged.

Y; MABSTRACTThis annual report presents results of an ongoing research programinto the reliability of terrestrial solar cells. Laboratory acceleratedtesting procedures are used to identify failure/degradation modes which arethen related to basic physical, chemical, and metallurgical phenomena. Inthe most recent tests, ten different types of production cells, both withand without encapsulation, from eight different manufacturers weresubjected to a variety of accelerated tests. Results indicated the presenceof a number of hitherto undetected failure mechanisms, including Schottkybarrier formation at back contacts and loss of adhesion of gridmetallization. The mechanism of Schottky barrier formation can be explainedby hydrogen, formed by the dissociation of water molecules at the contactsurface, diffusing to the metal semiconductor interface. This samemechanism can account for the surprising increase in sensitivity toaccelerated stress conditions that was observed in some cells whenencapsulated.ivd

Y5 n 1 . V 1'1.TN,9EXECUTIVE SUMMARYrrThis annual report is a summary of reliability research beingconducted at Clemson University relating to failure/degradation mechanismswhich can occur at the basic cell level. The research approach taken is tofirst detect the mechanical change and/or electrical degradation, which is7charateristic of a particular cell construction, through the use ofYllaboratory accelerated testing procedures, and then through detailedanalysis to determine the basic physical, chemical, or metallurgicalphenomena involved. In this report recent test results have been tabulatedand the degradation mechanisms identified where possible for ten differentunencapsulated state-of-the-art crystalline cell types from eight different3manufacturers. Major program accomplishments are identified in vhisexecutive summary.Schottky Barrier Contact FormationAccelerated testing of unencapsulated cells uncovered a new degradationYfImechanism, not previously identified, affecting one type of cell4construction. In this case degradation was accompanied by the formation ofa distinctly non-linearity IV characteristic, primarily after exposure tobias-temperature testing, which greatly reduced the cell's maximum poweroutput. It was concluded that a rectifying Schottky barrier had formed atthe back contact. The particular cell construction where this was observedhad a lightly doped substrate (no back surface field) and relied on a highconcentration of surface states to give a low barrier height and consequentP t-y {wV

Yokj*rohmic contact. It is felt that atoms from the test environment,most likely1hydrogen from dissociated water vapor, diffuse to the interface reducing'pthe concentration of surface states. This increases the barrier height anddresults in a rectifying Schottky barrier. A series of additional controlledexperiments to clearly define the role played by moisture in the Schottkybarrier formation process is currently being planned.Loss of Grid AdhesionAnother failure mode also detected from testing unencapsulated cells, whichaffected a different cell and whose cause is still under investigation, was the catastrophic loss of grid adhesion. Some loss of adhesion was noticedon other cell types, but not to this extent. The phenomenon affected allcells in a given lot and became so bad after a relatively short that anumber of the tests had to be discontinued prior to their planned endpoint. Discussions with the manufacturer indicated the probable cause wascontamination during processing and experiments are currently underway todetermine if this is the case.Enhanced Degradation of Encapsulated CellsIn addition to testing unencapsulated cells, nine of the cell types weretested as encapsulated single cell modules, which used differentcombinations of substrate, superstrate, and pottant materials. In all,seven different encapsulation configurations were involved. Theencapsulated cells were subjected only to 85/85 and thermal cycle testing,however, because of a 100 0C temperature limit on the organic pottantvi44! J

TtP,materials used. A somewhat surprising result, which had been suspected as aresult of earlier preliminary encapsulated cell testing, was confirmed bythis present work -- encapsulated cells show appreciably greaterp.degradation in many cases than unencapsulated cells. This is believed to bea result of the widely different penetration rates for water vapormolecules and their dissociation products, hydrogen and oxygen, innonhermetic substrate materials. As a result, hydrogen and oxygen becometrapped at the interface increasing the probability of one of these atomicspecies, most ikely hydrogen, diffusing to the silicon surface and changingthe surface state density. As expected, however, encapsulation was found tooffer protection against catastrophic mechanical type failures.Little Protection Offered by Foil SubstratesAccelerated stress testing of encapsulated cells also showed that foilsubstrates behaved essentially the same as the non hermetic materials, i.e.they tended to increase cell degradation over what it was forunencapsulated cells. The phenomenon of trapping dissociation products at ametal — plastic boundary described above can also be used to explain thisineffectiveness of thin foil substrates. Hydrogen is able to diffusethrough the foil whereas water vapor cannot. The only foil material testedwas 1—mil aluminum and it is possible that other materials and thicknessescould provide better protection.New Test and Analytical FacilitiesAn outdoor real time cell test facility is now in operation. Individualr ;viiVW .Q.

er.- .-. . q; p!'Tl' '.' .vr, .?up R-. n: t. . ,. R,.,a .,,.,'r.,. .r r.c v.m . ,. A I,,toJ cells, either encapsulated or unencapsulated, can be mounted on carriers,relectrically measured under controlled conditions in the laboratory, andthen attached to an outdoor inclined frame for long term environmentalexposure. It is hoped that periodic remeasurement will detect degradationeffects similar to those observed during accelerated testing and thatcorrelation between the two mmethods can be established.A new electron microscope analytical facility which will be devoted tosemiconductor device reliability research is being constructed at Clemson.The facility will be an addition to Clemson's existing central electron}microscope facility and will contain a high resolution (40 ) scanningscope with x-ray wavelength dispersion and voltage contrast capability, andan Auger microprobe with scanning ion microprobe capability. The newInstrumentation will be used to acquire quantitative information regardingcell degradation mechanisms. A workshop is planned for the spring of 1984ito acquaint the photovoltaic community with the topological and analyticalcapabilities of the facility.k.Ir, Je1 viii

TTABLE OF CONTENTS4IPageSectionCLEMSON PERSONNEL .iiACKNOWLEDGEMENT .iiiABSTRACT .ivwEXECUTIVE SUMMARY .vTABLEOF CONTENTS .ixLIST OF FIGURES .xLIST OF TABLES .xi1.0INTRODUCTION .12.0ACCELERATED STRESS TESTING OF UNENCAPSULATED CELLS .92.1 Description of Cells .92.2 Description of Tests .162.3 Test Results .203.0STRESS TESTING OF ENCAPSULATED CELLS .473.1 Introduction .473.2 85/85 Test Results .503.3 Thermal Cycle Test Results .564.0DETERMINATION OF FAILURE MECHANISMS .59.594.1 Introduction . . .4.2 Schottky Barrier Formation .60.684.3 Loss of Grid Adhesion.4.4 New Clemson Research Facility .695.0ADDITIONAL TEST DEVELOPMENT .75.755.1 Introduction . .5.2 Outdoor Real-Time Testing .755.3 Sulfur Dioxide Testing .796.0CONCLUSIONS .837.0 NEW TECHNOLOGY .87J8.0 PROGRAM RESEARCH CONTRIBUTIONS .919.0REFERENCES .95APPENDIX A. Design of SOp Accelerated Test SystemAPPENDIX B. Method of Determining Metal-Semiconductor Barrier HeightAPPENDIX C. Publication Abstractsix

a nwY" a. al'. a aRim /T t ifOY - ,.i1 T!1'1"T.S)T11S. YSR tihLIST OF FIGURESFigurePage1 Photographs of Cells in the Unencapsulated Test Program .112 Photograph of Initial Plating Defect .173 Clemson Accelerated Test Schedule for Unencapsulated Cells . 184 Examples of "Moderate" Mechanical Defects .295 Photograph of Thermal Shock Induced Defect .436 Typical Characteristics of Cells Subjected to 8-T testing . 617 Simulation of Non-Linear Contact Degradation .628 IV Characteristic of a Q-Cell after 600 Hours at 150 C as Fittedby SPICE Model Incorporating a Rectifying Contact. . I . iA9 150OX SF.M Photographs of Cell surfaces .7010 Photograph of Outdoor Real-Time Test Arrays . 1711 Photograph of Typical Cell Holder/Carrier for Real-Time Test. 78aFIr ix

y. !'TLIST OF TABLES14TablePage1Unencapsulated Cell Types Classified by Primary Metallization . 102Unencapsulated Cell 8-T Test Results (Electrical Degradation) . 233Unencapsulated Cell 8-T Test Results (Catastrophic Mechanical) . 274Unencapsulated Cell 85/85 Test Results (Electrical Degradation) . 315Unencapsulated Cell 85/85 Test Results (Catastrophic Mechanioal).326Unencapsulated Cell PC Test Results (Electrical Degradation) . 337Unencapsulated Cell PC Test Results (Catastrophic Mechanical) . 358Unencapsulated Cell Thermal Cycle Test Results (ElectricalDegradation) .379Unencapsulated Cell Thermal Cycle Test Results (CatastrophicMechanical) .3810Unencapsulated Cell Thermal Shock Results (ElectricalDegradation) .4011 Unencapsulated Cell Thermal Shock Results (CatastrophicMechanical) .4112Status of Encapsulated Cell 85/85 Testing .4913 Average % Decrease in Maximum Power for Encapsulated CellsSubjected to 2000 hours of 85/85 Testing .52I" F'tLxi

Jr1.0 INTRODUCTIONiyv -1rr„1L

. ,. . :',., r .: . . .-. ,.,,,". „it.177 '11.0 INTRODUCTIONiThis is the Fourth Annual Report on the Investigation of AcceleratedStress Factors and Failure/Degradation Mechanisms in Terrestrial SolarCells, a photovoltaic cell reliability research program which has beenconducted by Clemson University for the Flat-Plate Solar Array (FSA) Projectof the Jet Propulsion Laboratories, The objective of the research is thedetermination of fundamental physical, chemical, and metallurgical phenomenawhich cause solar cells to degrade with time, The approach followed was todesign laboratory test procedures which would accelerate anticipated fieldfailure modes, and then to subject quantities of different types ofcommercially available cells to them. Testing was performed on bothencapsulated and unencapsulated cells. The electrical and physical resultsof this testing could then be analyzed in an effort to identify tho basicphenomena underlying the degradation. Corrective action would then bepossible during manufacture to avoid the observed problem. Tht program wasinitiated in December of 1977 and earlier reports (1,2,3,4) have discussedmany of the experimental and analytical methods employed, the data collectedon several types of cells, and a number of preliminary conclusions. It isithe purpose of this report to present the results obtained on the mostk,m'recent group of cells which have undergone testing, to describe new.r:'cdegradation mechanisms and phenomena which were found, and to discuss newanalytical methods currently under development.110ttbyAs a result of their inherent simplicity, coupled with the lack ofconstraining specifications, solar cells are very reliable structures.e3-RECEDING PACTS BLANK NOT FILMED, , bfY 0110NA.r, 5LA116

Mpia'IVerification of this degree of reliability is exceedingly difficult,however. Obviously accelerated testing is required which will result inmeasurable degradation in a reasonably short time, i.e. acceleration factorsof 100 or more are required. Furthermore, as one moves progressively furtheraway from the basic unencapsulated cell towards the finished photovoltaicarray it becomes more difficult to increase the applied acceleratingstresses without introducing extraneous failure modes and invalidating thetest procedures. Section 3.0 of this report covers the first meaningful andsystematic attempt to achieve accelerated degradation in encapsulated cells.As verified by results obtained on the most recent group of cells,unencapsulated cell testing remains the most effective technique forproducing significant degradation in sensitive cell types within a shorttime. Although absolute acceleration factors have not been determined,results are significant in their ability to differentiate between celltypes. Although different failure/degradation modes were observed, many of?the basic mechanisms behind these modes remain a mystery. On one particularcell construction, however, it was possible to interpret the observedmaximum power degradation as being consistant with Schottky barrierformation at the back contact, as described in Section 4.2.A first step towards establishing a relationship between acceleratedtest results and effects which occur in real time was begun during thisreporting period. To accomplish this both encapsulated and unencapsulatedsingle cells were mounted in outside racks and loaded at approximately themaximum power point. The individual cells were mounted in such a way thatthey could be removed for accurate measurement in the laboratory. It isti4

J hoped that data accumulated in this way can be used to determine actualacceleration factors and to gain assurance that the same failure modes arebeing observed in the laboratory as in the field (Schottky barrierformation, for example).During this round of testing many of the cell types in the testprogram were donated by manufacturers. In order to encourage this type ofactivity, Clemson acquainted each manufacturer, who contributed cells, withthe accelerated test results of those cells as they occurred. Computerprintouts of the electrical measurement data on appropriate cell types weremailed directly to the manufacturer, with as many as eight mailings beingmade to some manufacturers during the test period. Although some difficultywas encountered in establishing a routine for accomplishing this, it is feltthe procedure was a success and should be continued.5r

gIIM1qpb IfiI Y'Y1YK2.0 ACCELERATED TESTING OF UNENCAPSULATED CELLStaI p aII7idI r9x{„nPRECEDING PAGE BLANK NOT FILMEDeErfLrr n 6GE l Io IF r a n.iJ. ur urnI

2.0 ACCELERATED STRESS TESTING OF UNENCAPSULATED CELLS2.1 Description of CellsSince the program was initiated, 23 unencapsulated cell types from 1211different manufacturers have undergone some degree of stress testing. Table1 summarizes, according to their primary metallizations, the 10 differentunencapsulated types of cells from 8 different manufacturers that were inthe latest group. Although the primary conductive metallization layer is thesame for many of the cells, the barrier/strike layers which seperate it fromthe silicon may be quite different, both in composition and thickness. Thereare essentially four different layered conductor systems in use today -copper plate, nickel plate, silver frit, and evaporated silver. The lattersystem is considered too expensive for present day terrestrial use and wasnot included in the present test group, although Ti-Pd-Ag cells have beentested in the past and found to be very reliable. The remaining threemetallization categories may include a solder coating to help provide thenecessary conductivity. The thick conductive layers could be easilyidentified, but more often than not the thin barrier/strike layers wereunknown. Furthermore, the composition of and deposition methods for theselayers vary from one manufacturer to another malting it difficult tointerpret the test results obtained on specific cell types in terms ofgeneralized metallization systems. Photographs of the ten different celltypes tested are shown in Figure 1. It can be seen that a wide variety ofcell constructions, including EFG and dendritic ribbon were involved.Because the grid configurations of cell types are so distinctive, making it9 IHIEHTIwt ,1 PRECEDING PAGE BLANK NOT FILMED)NALtX BUUIC

1P11r.4TABLE 1.UNENCAPSULATED CELL TYPESCLASSIFIED BY PRIMARY METALLIZATIONCELL TYPEN0PQRVwXYZCONDUCTING 10e

ORIGINAL PAGE 19OF POUR !lRt.!ti'Y,,.".oI",-,0Figure 1,rCells in Unencapsulated Test Program11

fs. aORIGINAL P A3L IOF POOR QUALITYFigure 1 (continued). Cells in Unencapsulated Test Program(Metallization difference only)412J

I4 7TORIGINALOF POGO,?iYf r1it I It feetI kk0.e Figure 1 (continued). Cells in Unencapsulated Test Program«W13

9URI(;NAL PfR j:: I,'OF Pc:-)Ft QUALI-1wirigure 1 (continued). Cells in Unencapsulated Test Program14

1ORIGINAL. P;, 2 VIOF POOR QUA , IYITIiT' eiFigure 1 (continued). Cells in Uciencapsul4ted Test Program.151w.

es'irelatively easy to identify the manufacturer, these photographs havepurposely not been correlated with the identifying letters used in thereport.Cells were visually inspected initially and at each downtime. Initialinspection revealed a continued improvement in quality over that forprevious samples. Only one cell type showed any appreciable defects onincoming inspection. This cell, which was plated, apparently had maskingwhich broke down and allowed spurious plating on the grid as shown in Figure2. The nodules were only lightly attached to the cell, but were firmlyattached to the grid lines. No uusual effects were observed duringunencapsulated testing, but one cell with this defect showed increaseddegradation during testing when encapsulated.2.2 Description of TestsIThe cells were subjected to the standard Clemson accelerated testschedule for unencapsulated cells shown in Figure 3 (*). As indicated, thereare 7 different tests, each having 4 down times. At the time of writing thisreport all cell types have not necessarily completed all down times, buttests are sufficiently far along that conclusions can be drawn with*NOTE: The 75 ,C oven containing the N-, 0-, P-, Q-, R-, and V-cells wasallowed to overheat when first turned on because the student in charge ofthe test forgot to take into account heating due to biasing. Consequentlythe oven reached 150 C and remained there for approximately 24 hours. It isfelt that this unfortunate occurrence accounts for the peculiar results seenin many of the cells where degradation was greater at 75 C than at highertemperatures. It is interesting that the reaction to this high temperatureexcursion, however, did not show up until a thousand hours later. whencomparing cell types bear in mind that the X-, Y-, and Z-cells did notexperience this excursion.16

(WobURlC!! AL P.-:JOF POORFY1 VITV1h .a) Light Fieldb) Dark FieldFigure 2.Photographs of Initial Plating Defects(40 x)17

Cn1.1 1.1 n11. bwxuJOU')H0.vVnOqvuONNCl)wwQa otoMNJDCDEurovwmMOuHvrl04U1L)u6CONONr-IUOI/ 1OhU0LOU0LOu0h00uUlOHuUpOLO00aco.Hwu OxV)JQC JQmco mFwwh 181Al

laATi'confidence. Initially, and at each down time, the cells were electricallymeasured and visually inspected. Electrical measurement consisted ofacquiring the IV characteristic curve and from it determining the parametersPm, Isc, Vm, Im, and Voc. Although the series and shunt resistances were notspecifically measured, the shape of the characteristic curves wasqualitatively inspected for non-linearity. The IV characteristic taken ateach measurement was saved in digital form for later retrieval if desired.The measurement system, which is capable of measuring parameters to 1%repeatability, is described in detail elsewhere (3,5). Of the electricalparameters, the maximum power output of the cell, Pm, is obviously the mostuseful in the measurement of degradation.Visual defects which occurred as a consequence of testing, and whichperhaps were exacerbated by handling, were detected by normal viewingprocedures without the aid of magnification. The defects so detected wereplaced in one of the following four catagories:leadsgrid contactback contactcell fractureOf these, the grid and back contact catagories are considered more seriousfrom a practical standpoint that the other two, because leads and celll aip3fractures are exacerbated by handling during testing and at the same timewill be protected in the field by encapsulation to a greater extent. Defectsrelating to each of these areas were then characterized as:1y'19

.low,J'âa10 no or very slight defect1 moderate defect2 severe defect (inoperative)2.3 Test Results2.3.1 General -- A number of things can happen to Pm, the maximumoutput power, when cells are subjected to accelerated testing. The followingis a partial list:1. Essentially no changeIndividual cells show only random changes of less than 3%2. Uniform changeAll cells show about the same amount of degradation3. Random changeSome cells show large degradation while others in the same lotshow slight or no change.G. Progressive changeCells show increased degradation with increased test time.5. Plateau effectDegradation levels out and does not decrease further with time.G. Threshold effectNo change to some point in time where a large change occurs.From an analytical standpoint it would be desireable to have thetest lots characterized as type-2. This would provide confidence that thel20

t.1W. yt(.i5test was uncovering a single well defined failure mode. Unfortunately manyI,test lots are type-3, making interpretation difficult. Often randomness(type-3), the plateau effect (type-5), and the threshold effect (type-6) canbe explained by simultaneously observing catastrophic behavior, such asleads missing, fractures, loss of metal adherence, etc. When a lead comesoff, for example, the output power will suddenly decrease, but will notchange further with time, assuming that the remaining leads remain attached.Because the number of cells of any one type in each test was small (maximumof 25), such random behavior does not lend itself readily to quantitativedata reduction methods, such as might yield a "one number" reliabili'cyfigure of merit. In order to be able to interpret the data, failure modescaused by accelerated testing have been divided into two categories:electrical degradationcatastrophic mechanical changeElectrical degradation is defined as a gradual and progressive change(usually a decrease) in Pm with no related visual effects (type-2 behavior).Examples of phenomenon which result in electrical degradation would beSchottky barrier formation at a contact and lifetime reduction through metaldiffusion. Catastrophic mechanical change is defined as visually detectablechange which would be expected to result in loss of power output, and whichfrequently can be characterized as "sudden". Examples would be loss of alead, loss of grid adherence, and cell fracturing. Visual changes which wereicosmetic, but which nevertheless might ulitmately lead to, or be related to,power loss were noted, but were not considered to be a primary part of thedata analysis since the eventual results would show up as either Pmlei5.21

kdegradation or as mechanical effects. Examples of cosmetic changes would bemetal discoloration and solder bump formation.In this report both accelerated test electrical measurement data andvisual data are presented in a series of tables. Most cell typessimultaneously exhibit both electrical degradation and mechanical changes.In an effort to seperate the two catagories, an effort has been made toremove the effect of mechanical change from the degradation tables. Thisexplains, for example, why the table describing the 150 )C B-T test, whichnominally has 20 cells, may show a lesser total number of cells as the testprogresses. For the most part only the data relating to cells whichexperienced catastrophic change was removed from the table summaries -- thecells themselves continued to undergo testing. An exception to the procedureof removing the data for mechanically damaged cells involved thermal cycleand thermal shock testing, which would be expected to introduce onlycatastrophic t y pe changes because of the short test times involved. In thesecases no attempt was made to remove data since only a single failure modecatagory was expected.2.3.2 Bias-Temperature Testing -- The electrical degradation results ofbias-temperature testing are given in Table 2. The reader is urged toexamine this table closely and note the regular progression of degradationwith time and temperature for most cells and to note also the differenceswhich exist between cell types. One cell type, the Q-cell, showed severeelectrical degradation which was interpreted as being due to Schottkybarrier formation at the back contact. This is discussed in detail inSection 4.2. Catastrophic mechanical changes are shown in Table 3. Two celltypes, the X- and Z-cells showed severe mechanical problems during B-T22

i4TABLE 2AUNENCAPSULATED CELL BIAS TEMPERATURE TEST RESULTSMAXIMUM POWER OUTPUT N-, 0-, AND P-CELLS aCell Temp Time 0202017151915181720207Range of Maximum Power Degradation3-9710-19720-29730-497 50-100%28474test in progress115test in progress4782646910910test in progress146910612test in progress14691131018855231data erratic1022310912322312511123

iTABLE 2BUNENCAPSULATED CELL BIAS TEMPERATURE TEST RESULTSMAXIMUM POWER OUTPUT Q-, R-, AND V-CELLSaiTotalTempTimeRange of Maximum Power Degradation10-19%CCells3-9%30-49% 12002400252524223222322test in progress1202020202020201612test in progress12253726101184I120test in progresslRR75

INVESTIGATION OF ACCELERATED STRESS FACTORS AND FAILURE/DEGRADATION MECHANISMS IN TERRESTRIAL SOLAR CELLS Z s. e FOURTH ANNUAL REPORT R I J.W. Lathrop 1 Department of Electrical and Computer Engineering Clemson University, Clemson, SC 29631 DOE/JPL - 954929-83/10 ENGINEERING AREA The JPL Flat-Plate Solar Array Project is sponsored by the U.S .

Related Documents:

qualification Radiation facility studies . SnPb with Pre -Aging. NEPP ETW - 2017. Reza Ghaffarian/JPL/Caltech. NEPP ETW - 2017. Reza Ghaffarian/JPL/Caltech. MLF68-10mm. NEPP ETW - 2017. Reza Ghaffarian/JPL/Caltech. MLF28-7mm. . The author would like to acknowledge the support of the JPL team and industry partners. The author also extends

1.4 importance of human resource management 1.5 stress management 1.6 what is stress? 1.7 history of stress 1.8 stressors 1.9 causes of stress 1.10 four major types of stress 1.11 symptoms of stress 1.12 coping with stress at work place 1.13 role of human resource manager with regard to stress management 1.14 stress in the garment sector

1 Accelerated Life Testing and Related Concepts 1 .l Introduction The terrn "Accelerated life test" applies to the type of study where failure times can be accelerated by applying higher "stress" to the cornponent. This implies that the failure time is a hnction of the so called "stress factor" and higher stress rnay bring quicker failure. .

1. Stress-Strain Data 10 2. Mohr Coulomb Strength Criteria and 11 Stress Paths 3. Effect of Different Stress Paths 13 4. Stress-Strain Data for Different Stress 1, Paths and the Hyperbolic Stress-Strain Relationship 5. Water Content versus Log Stress 16 6. Review 17 B. CIU Tests 18 1. Stress-Strain Data 18 2.

2D Stress Tensor x z xx xx zz zz xz xz zx zx. Lithostatic stress/ hydrostatic stress Lithostatic stress Tectonic stress Fluid Pressure-Hydrostatic-Hydrodynamic Lithostatic Stress Due to load of overburden Magnitude of stress components is the same in all

JPL Amateur Radio Club—Meeting at noon in Building 238-543. JPL Toastmasters Club—Meeting at 5 p.m. in the Building 167 conference room. Guests welcome. Call Joy Hodges at ext. 4-7041. Tu e s d a y , August 14 JPL Stamp Club—Meeting at noon in Building 183-328. Tues., Aug. 14–Wed., Au

James Bauer (JPL) Beau Bierhaus (Lockheed Martin) Dan Britt (U. of Central Florida) Julie Castillo-Rogez (JPL) Paul Chodas (JPL) Lori Feaga (U. of Maryland) Christine Hartzell (U. of Maryland) Carolyn Mercer (NASA Glenn) Angela Stickle (APL) The past as the key to the future Then ( 1980)

API –1.0.0 System Reads (user accounts, labor codes, and other configruations) Customer Read Equipment Read Equipment Hour Meter Write Product Read Inventory Read Work Order Read / Write Time Read / Write File Read / Write Web hooks for: Work Order status changes Work Order confirmations (tech, customer .