16-Bit 40/80 MSPS ADCs With LVDS/CMOS Outputs Datasheet

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ADS5560ADS5562www.ti.com . SLWS207 – MAY 200816-BIT, 40/80 MSPS ADCs WITH DDR LVDS/CMOS OUTPUTSFEATURES1 16-Bit ResolutionMaximum Sample Rate– ADS5562 - 80 MSPS– ADS5560 - 40 MSPSTotal Power– 865 mW at 80MSPS– 674 mW at 40MSPSNo Missing CodesHigh SNR 84 dBFS (3 MHz IF)85 dBc SFDR (3 MHz IF)Low Frequency Noise Suppression ModeProgrammable Fine Gain, 1dB steps till 6dBDouble Data Rate (DDR) LVDS and ParallelCMOS Output Options Internal/External Reference Support3.3-V Analog and Digital SupplyPin-for-pin with ADS5547 Family48-QFN Package (7 mm 7 mm)APPLICATIONS Medical Imaging - MRIWireless Communications InfrastructureSoftware Defined RadioTest and Measurement InstrumentationHigh Definition VideoDESCRIPTIONADS556X is a high performance 16-bit A/D converter family with sampling rates up to 80 MSPS. It supports veryhigh SNR for input frequencies in the first Nyquist zone. The device includes a low frequency noise suppressionmode that improves the noise from dc to about 1MHz.In addition to high performance, the device offers several flexible features such as output interface (either DoubleData Rate LVDS or parallel CMOS) and fine gain (in 1 dB steps till 6 dB).Innovative techniques, such as DDR LVDS and an internal reference that does not require external decouplingcapacitors, have been used to achieve significant savings in pin-count. This results in a compact 7 mm x 7 mm48 pin QFN package.The device can be put in an external reference mode, where the VCM pin behaves as the external referenceinput. For applications where power is important, ADS556X offers power down modes and automatic powerscaling at lower sample rates.It is specified over the industrial temperature range (-40 C to 85 C).1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.Copyright 2008, Texas Instruments Incorporated

ADS5560ADS5562DRGNDDRVDDAGNDAVDDSLWS207 – MAY 2008 . www.ti.comCLKPCLKOUTPCLOCKGENCLKMCLKOUTMD0 D1 PD0 D1 MD2 D3 PD2 D3 MD4 D5 Bit ADCD4 D5 MD6 D7 PD6 D7 MD8 D9 PD8 D9 MD10 D11 PVCMControlInterfaceReferenceD10 D11 MD12 D13 PD12 D13 MD14 D15 PD14 D15 MOVRMODEOEDFSRESETSENSDATASCLKADS556xLVDS INTERFACEB0095-05PACKAGE/ORDERING INFORMATION MEDIAADS5562QFN-48RGZ–40 C to 85 CAZ5562ADS5562IRGZTTape and Reel,smallADS5562IRGZRTape and Reel,largeADS5560IRGZTTape and Reel,smallADS5560IRGZRTape and Reel,largeADS5560(1)2QFN-48RGZ–40 C to 85 CAZ5560θJA 25.41 C/W (0 LFM Air Flow), θJC 16.5 C/W when used with 2 oz. copper trace and the thermal pad is soldered directly to aJEDEC standard four layer 3 in. x 3 in. (7.62 cm x 7.62 cm) PCB. Thermal pad is 5.2 x 5.2 mm. Please see mechanical drawings in theback of the datasheet for details.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008ABSOLUTE MAXIMUM RATINGS (1)over operating free-air temperature range (unless otherwise noted)VALUEUNITAVDDSupply voltage range–0.3 V to 3.9VDRVDDSupply voltage range–0.3 V to 3.9VVoltage between AGND and DRGND-0.3 to 0.3VVoltage between AVDD to DRVDD-0.3 to 3.3VVoltage applied to VCM pin (in external reference mode)-0.3 to 1.8VVoltage applied to analog input pins–0.3 V to minimum (3.6, AVDD 0.3 V)VTAOperating free-air temperature range–40 to 85 CTjmaxOperating junction temperature range125 CTSTGStorage temperature range–65 to 150 C220 CLead temperature 1,6 mm (1/16") from the case for 10 seconds(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.RECOMMENDED OPERATING CONDITIONSover operating free-air temperature range (unless otherwise noted)MINTYPMAXUNIT33.33.6V33.33.6VSUPPLIES AND REFERENCESAVDDAnalog supply voltageDRVDD Digital supply voltageANALOG INPUTSDifferential input voltage range (with default fine gain 1 dB)Input common-mode voltageVoltage applied on VCM in external reference mode3.56VPP1.5 0.1V1.5 0.05VCLOCK INPUTSample rateDEFAULT SPEED modeADS5562LOW SPEED mode(1)DEFAULT SPEED modeADS5560LOW SPEED mode 3080MSPS130MSPS 3040MSPS130MSPSSine wave, LVPECL,LVDS, LVCMOSSupported clock waveform formatsClock amplitude, ac-coupled, differential (VCLKP - VCLKM)0.4Clock duty cycle45%VPP50%55%DIGITAL OUTPUTSCLMaximum external load capacitance from each output pin to DRGND (LVDS and CMOSmodes)RLDifferential external load resistance between the LVDS output pairs (LVDS mode)Operating free-air temperature(1)5pFΩ100-4085 CSee Low sampling frequency operation in application section for details.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS55623

ADS5560ADS5562SLWS207 – MAY 2008 . www.ti.comELECTRICAL CHARACTERISTICSTypical values are at 25 C, AVDD DRVDD 3.3 V, sampling rate Max Rated, sine wave input clock, 1.5 VPP clockamplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, DDR LVDS interface, default finegain (1dB).Min and max values are across the full temperature range TMIN –40 C to TMAX 85 C, AVDD DRVDD 3.3 V, samplingrate Max Rated, unless otherwise alog input bandwidth300300MHzAnalog input commonmode current (per input pin)6.66.6µA/MSPSANALOG INPUTDifferential input voltagerange (1)Differential inputcapacitanceVCMCommon mode outputvoltageInternal referencemode1.51.5VVCM output currentcapabilityInternal referencemode 4 4mAAssuredAssuredDC ACCURACYNo Missing Codes0 dB gainDNLDifferential non-linearity-0.950.53-0.950.53LSBINLIntegral non-linearity-8.5 38.5-8.5 38.5LSBOffset error-25 1025-25 1025mVOffset error temperaturecoefficient0.0050.005mV/ CVariation of offset erroracross AVDD supply1.51.5mV/VThere are two sources of gain error: i) internal reference inaccuracy and ii) channel gainerrorEGREFGain error due to internalreference inaccuracy alone-2.5ECHANChannel gain error alone-2.5Channel gain errortemperature coefficient 12.5-2.5 12.5-2.50.01 12.5 12.5%FS%FSΔ%/ C0.01POWER SUPPLYIAVDDIDRVDDAnalog supply current2104160190mA5244mACMOS modeFIN 3 MHz6037mATotal powerLVDS mode865Standby powerSTANDBY modewith clock running155Digital supply currentCL 5 pFClock stop power(1)250LVDS modeIO 3.5 mA, RL 100 Ω1251100674810135150125mWmW150mWThe full-scale voltage range is a function of the fine gain settings. See Table 23.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008ELECTRICAL CHARACTERISTICS (Continued)Typical values are at 25 C, AVDD DRVDD 3.3 V, sampling rate Max Rated, sine wave input clock, 1.5 VPP clockamplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, DDR LVDS interface, 0 dB finegain (1).Min and max values are across the full temperature range TMIN –40 C to TMAX 85 C, AVDD DRVDD 3.3 V, samplingrate Max Rated, default fine gain (1dB), unless otherwise noted.PARAMETERADS5562Fs 80 MSPSTEST CONDITIONSMINTYP7983.8ADS5560Fs 40 MSPSMAXMINTYPUNITMAXAC CHARACTERISTICSFIN 3 MHzFIN 10 MHzFIN 25 MHzSNRSignal to noiseratioLVDSinterfaceFIN 30 MHz82.881.8FIN 3 MHz81.7CMOSinterface7780.481.6Inputs tied to common-mode1.421.42FIN 25 MHzSINADFIN 30 MHzSignal to noise andFIN 3 MHzdistortion ratioFIN 10 MHzFIN 25 MHz80.575FIN 10 MHz80.5CMOSinterface73.5LVDSinterface12.2FIN 3 MHzFIN 10 MHz79797781.479.379.377.97813.18512.413.5888383FIN 30 MHz8079FIN 3 MHz907789dBFSdBFSbits9078FIN 25 MHzFIN 10 MHzLSB827585778379.580.2dBFS83.27680.5FIN 30 MHz(1)83.1FIN 30 MHzLVDSinterfacedBFS83.57881.8FIN 10 MHzHD2Second harmonic81.480.7FIN 3 MHzSFDRSpurious freedynamic range8482.5FIN 25 MHzENOBEffective numberof bits84.38083.2FIN 10 MHzRMS output noise84dBc947892FIN 25 MHz8890FIN 30 MHz8888dBcNote that after reset, the device is initialized to 1 dB fine gain setting. For SFDR and SNR performance across fine gains, see TypicalCharacteristics section.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS55625

ADS5560ADS5562SLWS207 – MAY 2008 . www.ti.comELECTRICAL CHARACTERISTICS (Continued)Typical values are at 25 C, AVDD DRVDD 3.3 V, sampling rate Max Rated, sine wave input clock, 1.5 VPP clockamplitude, 50% clock duty cycle, –1 dBFS differential analog input, default fine gain (1dB),internal reference mode, DDRLVDS interface 0 dB fine gain (1).Min and max values are across the full temperature range TMIN –40 C to TMAX 85 C, AVDD DRVDD 3.3 V, samplingrate Max Rated, default fine gain (1dB), unless otherwise noted.PARAMETERADS5562TEST CONDITIONSMINFIN 3 MHzHD3Third harmonicWorst harmonicother than HD2,HD3THDTotal harmonicdistortionTYPADS5560MAXMIN85FIN 10 MHz7785TYP78888383FIN 30 MHz8079FIN 3 MHz104104FIN 10 MHz102102FIN 25 MHz100101FIN 30 MHz100101FIN 3 MHz8475.583UNIT90FIN 25 MHzFIN 10 MHzMAXdBcdBc8876.586FIN 25 MHz8281dBcFIN 30 MHz8078IMDTwo-toneintermodulationdistortionFIN1 5 MHz, FIN2 10 MHzeach tone -7 dBFS9298dBFSVoltage overloadrecovery timeRecovery to 1% for 6-dBoverload11clockcycles(1)6Note that after reset, the device is initialized to 1 dB fine gain setting. For SFDR and SNR performance across fine gains, see TypicalCharacteristics section.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008DIGITAL CHARACTERISTICSDC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0or 1, AVDD 3.0V to 3.6V, IO 3.5 mA, RL 100 Ω (1) (2)PARAMETERTEST CONDITIONSMINTYPMAXUNITDIGITAL INPUTSHigh-level input voltage2.4VLow-level input voltage0.8VHigh-level input current33µALow-level input current-33µA4pFHigh-level output voltageDRVDDVLow-level output voltage0V4pFVODH High-level output voltage 350mVVODL Low-level output voltage-350mV1.2V4pFInput capacitanceDIGITAL OUTPUTS – CMOS MODEOutput capacitanceCapacitance inside the device from each output pin togroundDIGITAL OUTPUTS – LVDS MODEVOCM Output common-modevoltageOutput capacitance(1)(2)Capacitance inside the device from each output pin togroundAll LVDS and CMOS specifications are characterized, but not tested at production.IO refers to the LVDS buffer current setting; RL is the differential load resistance between the LVDS output pair.Dn Dn 1 PDn Dn 1 PLogic 0VODL –350 mV*Logic 1VODH 350 mV*Dn Dn 1 MDn Dn 1 MVOCMVGNDGND* With external 100-W terminationT0334-01Figure 1. LVDS Output Voltage LevelsSubmit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS55627

ADS5560ADS5562SLWS207 – MAY 2008 . www.ti.comTIMING CHARACTERISTICS – LVDS AND CMOS MODES (1)Typical values are at 25 C, AVDD 3.3 V, DRVDD 3.0 to 3.6V, Sampling frequency 80 MSPS, sine wave input clock,50% clock duty cycle, 1.5 VPP clock amplitude, CL 5 pF (2) , no internal termination, IO 3.5 mA, RL 100 Ω (3)Min and max values are across the full temperature range TMIN –40 C to TMAX 85 C, AVDD DRVDD 3.0 to 3.6V,unless otherwise noted.PARAMETERtaAperture delaytjAperture jitterTEST CONDITIONSTYPMAXUNIT0.51.22nsSampling frequency 80 MSPS90Sampling frequency 40 MSPS135Time to data stableWake-up timeMIN(4)after coming out of STANDBY mode60Time to valid data after stopping and restarting the input clockLatencyfs rmsfs rms200µs80µs16ClockcyclesDDR LVDS MODE (5)LVDS bit clock dutycycletsuData setup time (6)(6)Data valid (7) to zero-crossing of CLKOUTPZero-crossing of CLKOUTP to data becoming invalid(7)47%50%2.03.053%nsthData hold time2.03.0tPDIClock propagation delayInput clock rising edge cross-over to output clock rising edgecross-over9.51112.5nsnstrData rise timeRise time measured from –100 mV to 100 mV0.150.220.3nstfData fall timeFall time measured from 100 mV to –100 mV0.150.220.3nstrOutput clock rise timeRise time measured from –100 mV to 100 mV0.150.220.3nstfOutput clock fall timeFall time measured from 100 mV to –100 mV0.150.220.3nstOEOutput enable (OE) todata delayTime to data valid after OE becomes active700nsPARALLEL CMOS MODECMOS output clock dutycycle50%tsuData setup timeData valid (8) to 50% of CLKOUT rising edge6.58.0nsthData hold time50% of CLKOUT rising edge to data becoming invalid (8)2.03.0nstPDIClock propagation delayInput clock rising edge cross-over to 50% of CLKOUT risingedge6.37.89.3nstrData rise timeRise time measured from 20% to 80% of DRVDD1.01.52.0nstfData fall timeFall time measured from 80% to 20% of DRVDD1.01.52.0nstrOutput clock rise timeRise time measured from 20% to 80% of DRVDD0.71.01.2nstfOutput clock fall timeFall time measured from 80% to 20% of DRVDD1.21.51.8nstOEOutput enable (OE) todata delayTime to data valid after OE becomes active(1)(2)(3)(4)(5)(6)(7)(8)8200nsTiming parameters are ensured by design and characterization and not tested in production.CL is the effective external single-ended load capacitance between each output pin and ground.Io refers to the LVDS buffer current setting; RL is the differential load resistance between the LVDS output pair.Data stable is defined as the point at which the SNR is within 2dB of its normal value.Measurements are done with a transmission line of 100 Ω characteristic impedance between the device and the load.Setup and hold time specifications take into account the effect of jitter on the output data and clock.Data valid refers to logic high of 100 mV and logic low of -100 mV.Data valid refers to logic high of 2.6 V and logic low of 0.66 V.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008Table 1. Timing Characteristics at lower sampling frequenciesSamplingFrequency,MSPStsu,Setup time, nstho,Hold time, nstPDI,Clock propagation delay, nsDDR 1130.53233.5Parallel .5N 4N 3N 2N 1SampleNN 19N 18N 17N Output DataDXP, DXMEOEE – Even Bits D0,D2,D4,D6,D8,D10,D12,D14O – Odd Bits tPDIth16 Clock CyclesDDRLVDSON–13EON–12EOEONN–1EEOON 2N 1tPDICLKOUTtsuParallelCMOS16 Clock CyclesOutput N 1N 2T0105-08Figure 2. LatencySubmit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS55629

ADS5560ADS5562SLWS207 – MAY 2008 . CLKOUTMtsuthtsuOutputData Pair(1)(2)DnDn Dn 1 P,Dn Dn 1 MthDn(1)Dn 1(2)– Bits D0, D2, D4, D6, D8, D10, D12, D14Dn 1 – Bits D1, D3, D5, D7, D9, D11, D13, D15T0106-06Figure 3. LVDS Mode OutputData(1)DnDn(1)Dn – Bits D0–D15T0107-04Figure 4. CMOS Mode Timing10Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008DEVICE PROGRAMMING MODESADS5562 offers flexibility with several programmable features that are easily configured.The device can be configured independently using either parallel interface control or serial interfaceprogramming.In addition, the device supports a third configuration mode, where both the parallel interface and the serial controlregisters are used. In this mode, the priority between the parallel and serial interfaces is determined by a prioritytable (Table 3). If this additional level of flexibility is not required, the user can select either the serial interfaceprogramming or the parallel interface control.USING PARALLEL INTERFACE CONTROL ONLYTo control the device using parallel interface, keep RESET tied to high (DRVDD). Pins DFS, MODE, SEN,SCLK, and SDATA are used to directly control certain modes of the ADC. The device is configured byconnecting the parallel pins to the correct voltage levels (as described in Table 4 to Table 8). There is no need toapply reset.In this mode, SEN, SCLK, and SDATA function as parallel interface control pins. Frequently used functions arecontrolled in this mode—standby, selection between LVDS/CMOS output format, internal/external reference,two's complement/offset binary output format, and position of the output clock edge.Table 2 has a description of the modes controlled by the parallel pins.Table 2. Parallel Pin DefinitionPINDFSMODECONTROL MODESDATA FORMAT and the LVDS/CMOS output interfaceInternal or external referenceSENCLKOUT edge programmabilitySCLKLOW SPEED mode control for low sampling frequencies ( 30 MSPS)SDATASTANDBY mode – Global (ADC, internal references and output buffers are powered down)USING SERIAL INTERFACE PROGRAMMING ONLYTo program using the serial interface, the internal registers must first be reset to their default values, and theRESET pin must be kept low. In this mode, SEN, SDATA, and SCLK function as serial interface pins and areused to access the internal registers of ADC. The registers are reset either by applying a pulse on the RESETpin, or by a high setting on the RST bit (D1 in register 0x6C). The serial interface section describes theregister programming and register reset in more detail.Since the parallel pins DFS and MODE are not used in this mode, they must be tied to ground.USING BOTH SERIAL INTERFACE AND PARALLEL CONTROLSFor increased flexibility, a combination of serial interface registers and parallel pin controls (DFS, MODE) canalso be used to configure the device.The serial registers must first be reset to their default values and the RESET pin must be kept low. In this mode,SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC.The registers are reset either by applying a pulse on RESET pin or by a high setting on the RST bit (D1 inregister 0x6C). The serial interface section describes the register programming and register reset in more detail.The parallel interface control pins DFS and MODE are used and their function is determined by the appropriatevoltage levels as described in Table 7 and Table 8. The voltage levels are derived by using a resistor string asillustrated in Figure 5. Since some functions are controlled using both the parallel pins and serial registers, thepriority between the two is determined by a priority table (Table 3).Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS556211

ADS5560ADS5562SLWS207 – MAY 2008 . www.ti.comTable 3. Priority Between Parallel Pins and Serial RegistersPINFUNCTIONS SUPPORTEDMODEPRIORITYInternal/External referenceWhen using the serial interface, bit REF (register 0x6D, bit D4) controls this mode, ONLYif the MODE pin is tied low.DATA FORMATWhen using the serial interface, bit DF (register 0x63, bit D3) controls this mode, ONLY ifthe DFS pin is tied low.LVDS/CMOSWhen using the serial interface, bit ODI (register 0x6C, bits D3-D4) controls LVDS/CMOSselection independent of the state of DFS pinDFSDRVDD(5/8) DRVDD3R(5/8) DRVDDGNDDRVDD2R(3/8) DRVDD(3/8) DRVDD3RTo Parallel PinGNDS0321-02Figure 5. Simple Scheme to Configure Parallel Pins12Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008DESCRIPTION OF PARALLEL PINSTable 4. SCLK Control PinSCLK0DRVDDDESCRIPTIONDEFAULT SPEED mode - Use for sampling frequencies 30 MSPS.LOW SPEED mode Enabled - Use for sampling frequencies 30 MSPS.Table 5. SDATA Control PinSDATA0DRVDDDESCRIPTIONNormal operation (Default)STANDBY. This is a global power down, where ADC, internal references and the output buffers are powered down.Table 6. SEN Control PinSENWith CMOS interface0CLKOUT Rising edge later by (3/36)TsCLKOUT Falling edge later by (3/36)Ts(3/8)DRVDDCLKOUT Rising edge later by (5/36)TsCLKOUT Falling edge later by (5/36)Ts(5/8)DRVDDCLKOUT Rising edge earlier by (3/36)TsCLKOUT Falling edge earlier by (3/36)TsDRVDDDefault CLKOUT positionWith LVDS interface0CLKOUT Rising edge later by (7/36)TsCLKOUT Falling edge later by (6/36)Ts(3/8)DRVDDCLKOUT Rising edge later by (7/36)TsCLKOUT Falling edge later by (6/36)Ts(5/8)DRVDDCLKOUT Rising edge later by (3/36)TsCLKOUT Falling edge later by (3/36)TsDRVDDDefault CLKOUT positionTable 7. DFS Control PinDFS0DESCRIPTION2's complement data and DDR LVDS output (Default)(3/8)DRVDD2's complement data and parallel CMOS output(5/8)DRVDDOffset binary data and parallel CMOS outputDRVDDOffset binary data and DDR LVDS outputTable 8. MODE Control PinMODEDESCRIPTION0Internal reference(3/8)AVDDExternal reference(5/8)AVDDExternal referenceAVDDInternal referenceSERIAL INTERFACEThe ADC has a set of internal registers, which can be accessed through the serial interface formed by pins SEN(Serial interface Enable), SCLK (Serial Interface Clock), SDATA (Serial Interface Data) and RESET. After devicepower-up, the internal registers must be reset to their default values by applying a high-going pulse on RESET(of width greater than 10 ns).Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS556213

ADS5560ADS5562SLWS207 – MAY 2008 . www.ti.comSerial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every falling edgeof SCLK when SEN is active (low). The serial data is loaded into the register at every 16th SCLK falling edgewhen SEN is low. If the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data is loaded inmultiples of 16-bit words within a single active SEN pulse.The first 8 bits form the register address and the remaining 8 bits form the register data. The interface can workwith SCLK frequency from 20 MHz down to very low speeds (few Hertz) and also with non-50% SCLK dutycycle.REGISTER INITIALIZATIONAfter power-up, the internal registers must be reset to their default values. This is done in one of two ways:1. Either through hardware reset by applying a high-going pulse on RESET pin (of width greater than 10 ns) asshown in Figure 6.OR2. By applying software reset. Using the serial interface, set the RST bit (D1 in register 0x6C) to high. Thisinitializes the internal registers to their default values and then self-resets the RST bit to low. In this casethe RESET pin is kept low.Register AddressSDATAA7A6A5A4A3A2Register OADH)t(SLOADS)SENRESETFigure 6. Serial Interface Timing DiagramSERIAL INTERFACE TIMING CHARACTERISTICSTypical values at 25 C, min and max values across the full temperature range TMIN –40 C to TMAX 85 C,AVDD DRVDD 3.3 V (unless otherwise noted)MINMAXUNIT20MHzSCLK frequencytSLOADSSEN to SCLK setup time25nstSLOADHSCLK to SEN hold time25nstDSUSDATA setup time25nstDHSDATA hold time25ns14 DCTYPfSCLKSubmit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008RESET TIMINGTypical values at 25 C, min and max values across the full temperature range TMIN –40 C to TMAX 85 C,AVDD DRVDD 3.3 V (unless otherwise noted)t1t2PARAMETERTEST CONDITIONSPower-on delayDelay from power-up of AVDD and DRVDD to RESET pulse activeMINTYPMAX5ms10Reset pulse widthPulse width of active RESET signalt3Register write delayDelay from RESET disable to SEN activetPOPower-up timeDelay from power-up of AVDD and DRVDD to output stableUNITns125µsns6.5msPower SupplyAVDD, DRVDDt1RESETt2t3SENNOTE: A high-going pulse on RESET pin is required in serial interface mode in case of initialization through hardware reset.For parallel interface operation, RESET has to be tied permanently HIGH.Figure 7. Reset Timing DiagramSubmit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS556215

ADS5560ADS5562SLWS207 – MAY 2008 . www.ti.comSERIAL REGISTER MAPTable 9 gives a summary of all the modes that can be programmed through the serial interface.Table 9. Summary of Functions Supported by Serial Interface (1) (2)REGISTERADDRESSIN HEXA7 - A0REGISTER FUNCTIONSD7D6D5D4D3D2 CLKOUT POSN OUTPUT CLOCK POSITION PROGRAMMABILITY6265 STBY GLOBALPOWERDOWN DF DATA FORMAT 2's COMP orOFFSET BINARY GAIN FINE GAIN 0dB to 6dB, in 1dB steps69 CUSTOM A CUSTOM PATTERN (D7 TO D0)6A CUSTOM B CUSTOM PATTERN (D15 TO D8) ODI OUTPUT DATA INTERFACEDDR LVDS or PARALLEL CMOS6C REF INTERNAL orEXTERNALREFERENCE6D RST SOFTWARERESET6E16 LOW SPEED ENABLE LOWSAMPLINGFREQUENCYOPERATION TEST PATTERN – ALL 0S, ALL 1s,TOGGLE, RAMP, CUSTOM PATTERN68(1)(2)D0 LF NOISESUPPRESSION 5D63D17E DATA TERM INTERNAL TERMINATION – DATAOUTPUTS7F CURR DOUBLE LVDS CURRENT DOUBLE CLKOUT TERM INTERNAL TERMINATION – OUTPUT CLOCK LVDS CURR LVDS CURRENTPROGRAMMABILITYThe unused bits in each register (shown by blank cells in above table) must be programmed as ‘0’.Multiple functions in a register can be programmed in a single write operation.Submit Documentation FeedbackCopyright 2008, Texas Instruments IncorporatedProduct Folder Link(s): ADS5560 ADS5562

ADS5560ADS5562www.ti.com . SLWS207 – MAY 2008DESCRIPTION OF SERIAL REGISTERSEach register function is explained in detail below.Table 10.A7 - A0 (hex)D7D6D5D4D3D2D1D0 LF NOISESUPPRESSION 5DD0 LF NOISE SUPPRESSION Low frequency noise suppression0Disable low frequency noise suppression1Enable low frequency noise suppressionTable 11.A7 - A0 (hex)D7D6D5D4D3D2D1D0 CLKOUT POSN OUTPUT CLOCK POSITION PROGRAMMABILITY62D4 - D0 CLKOUT POSN Output Clock Position Programmabi

IN 10 MHz LVDS 79 83.8 80 84 dBFS F interface IN 25 MHz 83.2 82.5 SNR F IN 30 MHz 82.8 81.8 Signal to noise ratio F IN 3 MHz 81.7 83.5 F IN 10 MHz CMOS 77 81.4 78 83.1 dBFS F interface IN 25 MHz 80.7 81.8 F IN 30 MHz 80.4 81.6 RMS output noise Inputs tied to common-mode 1.42 1.42 LSB F IN 3 MH

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8127FS–AVR–02/2013 4. Register Summary Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F SREG I T H S V N Z C Page 12 0x3E SPH Stack Poin

8-Bit, 500 MSPS, 1.8 V Analog-to-Digital Converter (ADC) Data Sheet AD9286 Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use.