SiGe BiCMOS INTEGRATED CIRCUIT PPD5740T6N
SiGe BiCMOS INTEGRATED CIRCUIT PD5740T6NDLOW NOISE WIDEBAND AMPLIFIER IC WITH THROUGH FUNCTIONUEDESCRIPTIONThe PD5740T6N is a low noise wideband amplifier IC mainly designed for the portable digital TV application.This IC has achieved low noise figure and the wideband operation. The PD5740T6N has an LNA pass-throughfunction (bypass function) to prevent the degradation of the received signal quality at the strong electric field, andachieve the high reception sensitivity and low power consumption.The package is a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) suitable for surface mount.This IC is manufactured using our latest SiGe BiCMOS process that shows superior high frequency characteristics.ONTINFEATURES Low voltage operation: VCC 2.3 to 3.3 V (2.8 V TYP.) Low mode control voltage: Vcont (H) 1.0 V to VCC, Vcont (L) 0 to 0.5 V Low current consumption: ICC1 5.0 mA TYP. @ VCC 2.8 V (LNA-mode): ICC2 1 A MAX. @ VCC 2.8 V (Bypass-mode) Low noise (LNA-mode): NF1 1.5 dB TYP. @ VCC 2.8 V, f 470 MHz: NF2 1.5 dB TYP. @ VCC 2.8 V, f 770 MHz High gain (LNA-mode): GP1 15.0 dB TYP. @ VCC 2.8 V, f 470 MHz: GP2 13.5 dB TYP. @ VCC 2.8 V, f 770 MHz Low insertion loss (Bypass-mode): Lins1 1.1 dB TYP. @ VCC 2.8 V, f 470 MHz: Lins2 1.3 dB TYP. @ VCC 2.8 V, f 770 MHz High-density surface mounting: 6-pin plastic TSON (T6N) package (1.5 1.5 0.37 mm) Included protection circuits for ESDAPPLICATIONSC Low noise amplifier for the portable and mobile digital TV system, etc.ORDERING INFORMATIONPart NumberOrder Number PD5740T6N-E2 PD5740T6N-E2-APackage6-pin plastic TSONDI(T6N) (Pb-Free)MarkingC3USupplying Form 8 mm wide embossed taping Pin 1, 6 face the perforation side of the tape Qty 3 kpcs/reelRemark To order evaluation samples, please contact your nearby sales office.Part number for sample order: PD5740T6N-ACaution: Observe precautions when handling because these devices are sensitive to electrostatic dischargeDocument No. PU10764EJ01V0DS (1st edition)Date Published June 2009 NSDownloaded from Arrow.com.
PD5740T6NPIN CONNECTIONS AND INTERNAL BLOCK DIAGRAMPin Name1INPUT2GND3Vcont4VCC5NC6OUTPUTUEDPin No.Remark Exposed pad : GNDTRUTH eRemark “H” Vcont (H), “L” Vcont (L)ABSOLUTE MAXIMUM RATINGSParameterSupply VoltageSymbolTest ConditionsRatingsUnitVCCTA 25 C3.6VMode Control VoltageVcontTA 25 C3.6VTotal Power DissipationPtot150mWOperating Ambient TemperatureTA 40 to 85 CStorage TemperatureTstg 55 to 150 CInput PowerPin 33dBmSCRECOMMENDED OPERATING ode Control Voltage (H)Vcont (H)1.0 VCCVMode Control Voltage (L)Vcont (L)0 0.5Vf50 1 800MHzOperating Ambient TemperatureTA 40 25 85 CInput Power (LNA-mode)Pin 7dBmInput Power (Bypass-mode)Pin 15dBmSupply VoltageDIOperating Frequency2Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
PD5740T6NELECTRICAL CHARACTERISTICS 1 (DC Characteristics)(T A 25 C, VCC 2.8 V, unless otherwise specified)ParameterSymbolTest ConditionsMIN.TYP.MAX.UnitICC1Vcont 2.8 V, No Signal (LNA-mode)3.85.06.5mACircuit Current 2ICC2Vcont 0 V, No Signal (Bypass-mode) 1 AMode Control Current 1Icont1Vcont 2.8 V, No Signal (LNA-mode) Mode Control Current 2Icont2Vcont 0 V, No Signal (Bypass-mode) DCircuit Current 1100 A 1 AUE40ELECTRICAL CHARACTERISTICS 2 (LNA-mode)(T A 25 C, VCC Vcont 2.8 V, unless otherwise specified)ParameterSymbolTest ConditionsMIN.TYP.MAX.UnitGP1f 470 MHz, Pin 30 dBm13.015.017.0dBPower Gain 2GP2f 770 MHz, Pin 30 dBm11.513.515.5dBNoise Figure 1NF1f 470 MHz, excluded PCB and 1.52.0dB 1.52.0dB ONTINPower Gain 1connector lossesNoise Figure 2NF2f 770 MHz, excluded PCB andconnector lossesInput Return Loss 1Input Return Loss 2Output Return Loss 1Output Return Loss 2Input 3rd Order Intercept Point 1NoteNoteRLin1f 470 MHz, Pin 30 dBm712 dBRLin2f 770 MHz, Pin 30 dBm710 dBRLout1f 470 MHz, Pin 30 dBm714 dBRLout1f 770 MHz, Pin 30 dBm711 dBIIP31f1 470 MHz, f2 471 MHz, 4.0 1.0 dBm 1.0 2.0 dBmPin 30 dBmInput 3rd Order Intercept Point 2IIP32f1 770 MHz, f2 771 MHz,Pin 30 dBmDISCNote Input PCB and connector losses: 0.05 dB (at 470 MHz), 0.08 dB (at 770 MHz)Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.3
PD5740T6NELECTRICAL CHARACTERISTICS 3 (Bypass-mode)(T A 25 C, VCC 2.8 V, unless otherwise specified)Insertion Loss 1SymbolTest ConditionsLins1f 470 MHz, Pin 10 dBm, excludedPCB and connector lossesInsertion Loss 2Lins2TYP.MAX.Unit 1.12dBNotef 770 MHz, Pin 10 dBm, excludedPCB and connector lossesMIN. NoteDParameter1.32dB20 dB17 dBRLin1f 470 MHz, Pin 10 dBm10Input Return Loss 2RLin2f 770 MHz, Pin 10 dBm10Output Return Loss 1RLout1f 470 MHz, Pin 10 dBm1020 dBOutput Return Loss 2RLout1f 770 MHz, Pin 10 dBm1017 dBIIP3f1 770 MHz, f2 771 MHz, 20 30 dBmInput 3rd Order Intercept PointPin 2.5 dBmUEInput Return Loss 1DISCONTINNote Input-output PCB and connector losses: 0.10 dB (at 470 MHz), 0.16 dB (at 770 MHz)4Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
PD5740T6NSTANDARD CHARACTERISTICS FOR REFERENCE 1 (LNA-mode)(T A 25 C, VCC Vcont 2.8 V, unless otherwise specified)ParameterSymbolTest ConditionsReferenceUnitISL1f 470 MHz, Pin 30 dBm20dBIsolation 2ISL2f 770 MHz, Pin 30 dBm20dBGain 1 dB Compression OutputDIsolation 1PO (1 dB) 1 f 470 MHzPower 1PO (1 dB) 2 f 770 MHzPower 2dBm 5.0dBmUEGain 1 dB Compression Output 5.5STANDARD CHARACTERISTICS FOR REFERENCE 2 (Bypass-mode)(T A 25 C, VCC 2.8 V, Vcont 0 V, unless otherwise specified)ParameterPowerf 770 MHzReferenceUnit 8dBmDISCTEST CIRCUITPO (1 dB)Test ConditionsONTINGain 1 dB Compression OutputSymbolData Sheet PU10764EJ01V0DSDownloaded from Arrow.com.5
PD5740T6NDISCONTINUEDTYPICAL CHARACTERISTICS 1 (DC Characteristics) (T A 25 C, unless otherwise specified)Remark The graphs indicate nominal characteristics.6Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
PD5740T6NDISCONTINUEDTYPICAL CHARACTERISTICS 2 (LNA-mode) (T A 25 C, unless otherwise specified)Remark The graphs indicate nominal characteristics.Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.7
DISCONTINUED PD5740T6NRemark The graphs indicate nominal characteristics.8Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
DISCONTINUED PD5740T6NRemark The graphs indicate nominal characteristics.Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.9
DISCONTINUED PD5740T6NRemark The graphs indicate nominal characteristics.10Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
DISCONTINUED PD5740T6NRemark The graphs indicate nominal characteristics.Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.11
PD5740T6NS-PARAMETERS 1 (LNA-mode) (T A 25 C, VCC Vcont 2.8 V, monitored at connector on board)DISCS22 FREQUENCYONTINUEDS11 FREQUENCYRemark The graphs indicate nominal characteristics.12Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
PD5740T6NDISCONTINUEDTYPICAL CHARACTERISTICS 3 (Bypass-mode) (T A 25 C, unless otherwise specified)Remark The graphs indicate nominal characteristics.Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.13
DISCONTINUED PD5740T6NRemark The graphs indicate nominal characteristics.14Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
DISCONTINUED PD5740T6NRemark The graphs indicate nominal characteristics.Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.15
ONTINUED PD5740T6NDISCRemark The graphs indicate nominal characteristics.16Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
PD5740T6NS-PARAMETERS 2 (Bypass-mode)(T A 25 C, VCC 2.8 V, Vcont 0 V, monitored at connector on board)DISCS22 FREQUENCYONTINUEDS11 FREQUENCYRemark The graphs indicate nominal characteristics.Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.17
PD5740T6NPACKAGE DIMENSIONSDISCONTINUED6-PIN PLASTIC TSON (T6N) (UNIT: mm)18Downloaded from Arrow.com.Data Sheet PU10764EJ01V0DS
PD5740T6NNOTES ON CORRECT USE(1) Observe precautions for handling because of electro-static sensitive devices.(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).All the ground terminals must be connected together with wide ground pattern to decrease impedancedifference.D(3) The bypass capacitor should be attached to VCC line.(4) Do not supply DC voltage to INPUT pin.RECOMMENDED SOLDERING CONDITIONSUE(5) Pin 5 (NC) should be connected to the ground pattern.This product should be soldered and mounted under the following recommended conditions.For solderingmethods and conditions other than those recommended below, contact your nearby sales office.Soldering MethodInfrared ReflowSoldering ConditionsPeak temperature (package surface temperature): 260 C or belowTime at peak temperature: 10 seconds or lessTime at temperature of 220 C or higherIR260: 60 seconds or less: 120 30 secondsONTINPreheating time at 120 to 180 CPartial HeatingCondition SymbolMaximum number of reflow processes: 3 timesMaximum chlorine content of rosin flux (% mass): 0.2%(Wt.) or belowPeak temperature (terminal temperature): 350 C or belowSoldering time (per side of device): 3 seconds or lessMaximum chlorine content of rosin flux (% mass): 0.2%(Wt.) or belowHS350DISCCaution Do not use different soldering methods together (except for partial heating).Data Sheet PU10764EJ01V0DSDownloaded from Arrow.com.19
Input 3 rd Order Intercept Point 1 IIP 3 1 f1 470 MHz, f2 471 MHz, P in 30 dBm 4.0 1.0 dBm Input 3 rd Order Intercept Point 2 IIP 3 2 f1 770 MHz, f2 771 MHz, P in 30 dBm 1.0 2.0 dBm . Note Input PCB and connector losses : 0.05 dB (at 470 MHz), 0.08 dB (at 770 MHz) DISCONTINUED .
Chalmers University of Tec hnology, Göteborg SE-41296, Sweden; bTerahertz and Millimetre Wave Laboratory, Department of Micr otechnology and Nanoscience (MC2), Chalmers University of Technology, Göteborg SE-41296, Sweden ABSTRACT A 110-170 GHz transceiver is designed and fabricated in a 130 nm SiGe BiCMOS technology. The transceiver operates
Ultra-deep submicron CMOS technology - Features - Advantages - Problems BiCMOS technology process flow - CMOS is typical submicron (0.5 µm) Summary CMOS Analog Circuit Design, 3rd Edition Reference New material . Lecture 04 - UDSM and BiCMOS Technologies (3/10/14) Page 04-2
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IC technology, non-CMOS processes have become a luxury that most IC producers cannot afford. IC Technology and Packaging Trends INTEGRATED CIRCUIT ENGINEERING CORPORATION 4-3 Introduction Growth Maturity Saturation Decline Obsolete Source: ICE, "Status 1996" 16809G ECL S/LS TTL HMOS NMOS TTL PMOS BIPOLAR ANALOG CMOS GaAs BiCMOS Diamond SiGe .
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